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What is an SMT device? What are the details?
Visit:204 Date:2021-08-12
Introduction to SMT Technology
Surface mount technology (Surfacd Mounting Technolegy referred to as SMT) is a new generation of electronic assembly technology, which combines traditional electronic components.
The components are compressed into a device of only a few tenths of the volume, thus realizing the high density, high reliability, miniaturization and low cost of electronic product assembly. And the automation of production. This kind of miniaturized components is called: SMY device (or SMC, chip device). Assemble components to printing (Or other substrates) The process method is called SMT process. The related assembly equipment is called SMT equipment.
At present, advanced electronic products, especially in computer and communication electronic products, have generally adopted SMT technology. International SMD device The output of components has increased year by year, while the output of traditional devices has decreased year by year. Therefore, SMT technology will become more and more popular with the passage of time.
Or say:
SMT stands for Surface Mounted Technology (abbreviation of Surface Mounted Technology), which is currently the most popular technology and process in the electronics assembly industry.

What are the characteristics of SMT:
High assembly density, small size and light weight of electronic products. The volume and weight of chip components are only about 1/10 of that of traditional plug-in components. Generally, after SMT is adopted, the volume of electronic products is reduced by 40%~60%, and the weight is reduced by 60%~ 80%.
High reliability and strong anti-vibration ability. The defect rate of solder joints is low.
Good high frequency characteristics. Reduce electromagnetic and radio frequency interference.
It is easy to realize automation and improve production efficiency. Reduce costs by 30%~50%. Save materials, energy, equipment, manpower, time, etc.

Why use SMT:
Electronic products are pursuing miniaturization, and the previously used perforated plug-in components can no longer be reduced.
Electronic products have more complete functions. The integrated circuits (ICs) used have no perforated components, especially large-scale, highly integrated ICs, so surface mount components have to be used.
With mass production of products and automation of production, the factory must produce high-quality products with low cost and high output to meet customer needs and strengthen market competitiveness.
The development of electronic components, the development of integrated circuits (IC), the diversified application of semiconductor materials The revolution of electronic science and technology is imperative and chasing the international trend.

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